Heat-Resistant Release Film/ TPX Film-JX series (FPC & High-temperature lamination application )
Thickness:120um (50um~150um is avliable)
Width:270mm(W270) / 560mm(W560)
Producting range: w
Heat resistance: Withstands temperatures up to 200℃
1.Meet the RoHS / REACH substances testing standards,Non-Silicon Oil material.
2.High temperature plastic with excellent performance, in the lamination process can be effectively prevent the adhesive.
3.With low pollution, good release-strength and dimensional stability from the type of features, And can be used for FPC / COF / Rigid-Flex lamination process.
4.Adhesive has good control effect.Suitable for use in the need to control the excess adhesive in the circuit board products.
Application process
For FPC Cover-Layer Lamination
For COF Cover-Layer Lamination
For Rigid-Flex Lamination